zero height "ultra-mini" sisonic tm microphone specification with enhanced rf protection - halogen free spu0409le5h-qb sheet 1 of 10 knowles acoustics, a division of knowles electronics, llc. release level: active revision: h knowles acoustics 1151 maplewood drive itasca, il 60143
zero height "ultra-mini" surface mount silicon microphone with enhanced rf protection - halogen free hand held consumer electronic devices spu0409le5h-qb sheet 2 of 10 knowles acoustics, a division of knowles electronics, llc. release level: active revision: h 1. description and application 1.1 description 1.2 application 2. part marking identification number convention s 1 2 3 4 5 6 7 s: manufacturing location "s" - knowles electronics suzhou suzhou, china "no alpha character" - knowles electronics itasca, il usa "e" - engineering samples digits 1-7: job identification number 3. temperature range 3.1 operating temperature range: -40 c to +100 c 3.2 storage temperature range: -40 c to +100 c
spu0409le5h-qb sheet 3 of 10 knowles acoustics, a division of knowles electronics, llc. release level: active revision: h 4. acoustic & electrical specifications test conditions: +20 c, 60-70% r.h. 5. frequency response curve
"l" "w" 1 "h" 0.562 (2x) 0.723 (2x) 0.612 1.932 2.031 1.224 0.612 1.015 0.485 0.966 0.534 2.102 (3x) 2.635 0.635 (2x) "ap" 2 4 3 1 5 6 spu0409le5h-qb sheet 4 of 10 knowles acoustics, a division of knowles electronics, llc. release level: active revision: h note: dimensions are in milimeters unless otherwise specified. tolerance 0.15mm unless otherwise specified. 6. mechanical specifications
0.562 (2x) 0.723 (2x) 0.612 1.224 0.612 1.015 (2x) 0.966 (2x) 0.635 (2x) 2.102 (3x) 3 4 1 2 5 6 45 45 0.150 (4x) refer to recommended land pattern for dimensions not shown. spu0409le5h-qb sheet 5 of 10 knowles acoustics, a division of knowles electronics, llc. release level: active revision: h 7. recommended customer land pattern 8. recommended solder stencil pattern
spu0409le5h-qb sheet 6 of 10 knowles acoustics, a division of knowles electronics, llc. release level: active revision: h 9. recommended interface circuit
12.0 0.3 1.75 0.10 5.50 0.05 4.00 4.16 0.10 3.40 0.10 1.5 0.0 + 0.1 1.5 0.0 + 0.1 2.00 0.05 8.00 0.10 a a 1.30 0.10 0.30 0.05 component orientation pin #1 spu0409le5h-qb sheet 7 of 10 knowles acoustics, a division of knowles electronics, llc. release level: active revision: h 10. packaging detail note: dimensions are in milimeters unless otherwise specified.
spu0409le5h-qb sheet 8 of 10 knowles acoustics, a division of knowles electronics, llc. release level: active revision: h 12. additional notes shelf life: twelve (12) months when devices are to be stored in factory supplied, (a) unopened esd moisture sensitive bag under maximum environmental conditions of 30oc, 70% r.h. msl (moisture sensitivity level) class 2a. (b) do not pull a vacuum over port hole of the microphone. pulling a vacum over the (c) port hole can damage the device. do not board wash after the reflow process. board washing and cleaning agents (d) can damage the device. do not expose to ultrasonic processing or cleaning. do not brush board after the reflow process. brushing the board with/without (e) solvents can damage the device. do not insert any object in port hole of device at any time as this can damage the (f) device. number of reflow - recommend no more than 3 cycles. (g) 11. solder flow profile
spu0409le5h-qb sheet 9 of 10 knowles acoustics, a division of knowles electronics, llc. release level: active revision: h note: after test conditions are performed, the sensitivity of the microphone shall not deviate more than 3db from its initial value. 13. reliability specifications
revision detailed specification changes date 1 preliminary specification release 6/25/2009 g updated to standard format. (dms, c10109829) 7/9/2009 h update response curve (section 5). (dms, c10110083) 7/20/2009 spu0409le5h-qb sheet 10 of 10 knowles acoustics, a division of knowles electronics, llc. release level: active revision: h 14. specification revisions the information contained in this literature is based on our experience to date and is believed to be reliable and it is subject to change without notice. it is intended as a guide for use by persons having technical skill at their own discretion and risk. we do not guarantee favorable results or assume any liability in connection with its use. dimensions contained herein are for reference purposes only. for specific dimensional requirements consult factory. this publication is not to be taken as a license to operate under, or recommendation to infringe any existing patents. this supersedes and voids all previous literature.
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